FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Development of low damage a-Si layers. Work on direct printing technology, metal lines optimization for bifaciality . Fraunhofer ISE will contribute to the development and characterization of passivated contacts within the project, supporting both the realization of the carrier selective layer stack on the wafer itself and the realization of the metallic structure on top of it. For the latter task, plating technology is employed by Fraunhofer ISE.